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List of Participants

Name Organisation Country
Emilio Allievi Emerson & Cuming - ICI Belgium NV Belgium
Wilfried Bair austriamicrosystems USA Inc. United States of America
Michael Bender Melexis GmbH Germany
Dr. Thomas Bever Infineon Technologies AG Germany
Loick Biancardini CEA France
Alexander Bodensohn DaimlerChrysler AG Germany
Ralf Bornefeld ELMOS Semiconductor AG Germany
Michael Brömmert Delphi Delco Electronics Europe GmbH Germany
Christof Buettner Raytheon Germany
Keiichi Buma DENSO Germany
Roland Burghardt Continental Teves Germany
Stephen Channon Ricardo Consulting Engineers United Kingdom
Dr. Ing. John Chivers Kulite Semiconductor Products, Inc. United Kingdom
Ir. Roger Diels Melexis Belgium
Thomas Diepold First Sensor Technology GmbH Germany
Peter Dortans VDIVDE-IT Technologiezentrum GmbH Germany
Alain Duchesne DAVEY BICKFORD France
Peiris Dunstan Ceramet Technologies PTE LTD Singapore
Ing. Hans Ensinger ENDEVCO Vertriebs GmbH Germany
Franz Faschinger austriamicrosystems AG Austria
Dr. Antoni Ferrè LEAR Corporation Spain
Dr. Hartmut Frerichs Philips Semiconductors Germany
Kay Christian Fuerstenberg University of Ulm Germany
Yoshiyuki Fujii Mitsubishi Electric Corporation Japan
Dr. Jane Galsworthy Quo-Tec Ltd United Kingdom
Ing. Hubert Geitner Analog Devices Germany
Wolfgang Gessner VDI/VDE-IT Germany
Ing. Thomas Goernig Conti Temic microelectronic GmbH Germany
Wilfried Goeser First Sensor Technology GmbH Germany
Dr. Ing. Klaus Gresser BMW AG Germany
Dr. Barbara Grieco STMicroelectronics S.r.l. Italy
Dr. Karsten Grimm Pierburg GmbH Germany
Kai Hackbarth ProSyst Software AG Germany
Bernhard Hartmann Conti Temic microelectronic GmbH Germany
Dr. Rainer Hermeling Delphi Delco Electronics Europe GmbH Germany
Ing. Antal Horvath Sales and Development Germany
Dr. Uwe Kaiser-Dieckhoff Robert Bosch GmbH Germany
Dr. Konrad Kapser ContiTemic Germany
Enno Kelling Continental Teves AG & Co. oHG Germany
Jürgen Kernhof Zentrum Mikroelektronik Dresden (ZMD) AG Germany
Willi Kiefel CEL Ireland
Dr. Simon Kim SAIT (Samsung Advanced Institute of Technology) South Korea
Ing. Marko Kleistner SiemensVDO Automotive AG Germany
Ing. Andreas Koppi Fraunhofer Germany
Dr. Dieter Kraft Robert Bosch GmbH Germany
Alfred Krappel Motorola GmbH Germany
Peter Krause First Sensor Technology GmbH Germany
Sven Krueger VDI/VDE-IT Germany
Heikki Kuisma VTI Technologies Oy Finland
Hannu Laatikainen VTI Technologies Oy Germany
Patrick Laborde ULIS France
Dr. Ulrich Lages Ibeo Automobile Sensor GmbH Germany
Dr. Ing. Markus Lang Robert Bosch GmbH Germany
Yann Le Guilloux SAGEM France
Hwei Yi Lee Singapore Economic Development Board Singapore
Dietmar Lenz Continental Temic Germany
Ing. Alex Lindl Kulite Semi-conductor GmbH Germany
Dr. Günter Lugert Siemens VDO Automotive AG Germany
Dr. Geert Luyckx Emerson & Cuming - ICI Belgium NV Belgium
Paul Mason Deakin University Australia
Dr. Torsten Mehlhorn Investitionsbank Berlin Germany
Jasmin Mehrgan VDIVDE-IT Technologiezentrum GmbH Germany
Paul Mirow Mirow Systemtechnik GmbH Germany
Paul Mulvanny QinetiQ Ltd. United Kingdom
Dr. Roland Müller-Fiedler Robert Bosch GmbH Germany
Dr. Takeshi Okamoto Matsushita Electric Works, Ltd. Germany
Ing. Marc Osajda MOTOROLA France
Marc Pajon FAURECIA France
Dr. Nereo Pallaro Centro Ricerche Fiat Italy
Dr. Ulf Palmquist EUCAR Belgium
Harivaden (Hari) Parmar Communication and Control Electronics Ltd United Kingdom
Heinz Ploechinger Thyracont GmbH Germany
Dr. Nigel Priestley e2v technologies United Kingdom
Dr. Frank Pöhlau Oechsler AG Germany
Michael Randt TRINAMIC Microchips GmbH Germany
Dr. Ing. Patrice Rey CEA France
Dr. Christian Rousseau Renault S.A. France
Partric Salomon 4M2C Patric Salomon Germany
Ulrich Schmid EADS Deutschland GmbH Germany
Ing. Simon Schofield Strategy Analytics United Kingdom
Hubert Schr?der Hella KG Germany
Florian Solzbacher First Sensor Technology GmbH Germany
Dr. Ing. Eckard Steiger Robert Bosch GmbH Germany
Andrè Strobel DaimlerChrysler AG Germany
Bob Sulouff Analog Devices Inc United States of America
Yasuo Tada Mitsubishi Electric Automotive Europe B.V. Netherlands
Hideki Takubo Mitsubishi Electric Automotive Europe B.V. Netherlands
Dr. Ing. Gerd Teepe Motorola Germany
Dr. Ing. Uwe Thomas Bundesministerium für Bildung und Forschung BMBF Germany
Dr. Jean Luc Tissot ULIS France
Dr. Guido Tschulena sgt Sensorberatung Germany
Georg Töbing SensoMotoric Instruments GmbH Germany
Dr. Makoto Uchiyama NISSAN MOTOR CO.,LTD. Japan
Berthold Ulmer DaimlerChrysler AG Belgium
Dr. Heiko Ulmer AppliedSensor GmbH Germany
Mohammed Usman e2v technologies United Kingdom
Dr. Jürgen Valldorf VDIVDE-IT Technologiezentrum GmbH Germany
Egon Vetter Ceramet Technologies Pty Ltd Australia
Hans-Christian von der Wense Motorola GmbH Germany
Jan von Horsten TRINAMIC Microchips GmbH Germany
Dr. Josef Wenger DaimlerChrysler AG Germany
Walter Wetzel ELMOS Semiconductor AG Germany
Dr. Stefan Wiesner Hella KG Hueck & Co. Germany
Dr. Bruno Wiest Canadian Embassy Germany
Rainer Willig Robert Bosch GmbH Germany
Harald Wolf Senatsverwaltung für Wirtschaft, Arbeit und Frauen Germany
Bernhard Wybranski VDI/VDE Technologiezentrum Informationstechnik GmbH Germany
Dr. Michael Wycisk Infineon Technologies Germany
Dr. Dirk Wüllner Hella KG Hueck & Co. Germany
Dr. Jean-Jacques YON CEA-GRENOBLE France